SLM Subsystem for Automotive SoC: Case Study on Path Margin Monitor.

Kranthi Kandula, Ramalingam Kolisetti,Grigor Tshagharyan,Gurgen Harutyunyan,Yervant Zorian

2023 IEEE International Test Conference (ITC)(2023)

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摘要
As the size and complexity of System-on-Chip (SoC) continue to grow, product performance and durability requirements have also become a vital part of chip design. By deploying monitors and structures built into the silicon design, we can obtain real-time data on the performance of the chip, which in turn can be used to study the health of the silicon and predict its degradation. This is a particularly important requirement for safety-critical applications such as automotive. In this paper, a case study of Path Margin Monitor (PMM) is presented as part of an automotive SoC subsystem that can monitor the functional paths of silicon in real-time throughout the entire silicon lifecycle.
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关键词
path margin monitor,silicon Lifecycle,automotive,system performance
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