Fractography analysis of Sn-58Bi solder joint after addition of cobalt nanoparticles

Miniaturization of electronic devices causes reliability issues in solder joints such as a reduction in mechanical, structural, and electrical properties. This work focuses on studying the effects of cobalt nanoparticle (NP) addition on the structural and mechanical properties of the Sn-58Bi solder joint. 0, 0.5, 1, and 2