Research on Distribution of the Condensed Substance on a Flat Support and Obtaining Vacuum Evaporation Thin Films with Uniform Thickness by Correction Masks

The thickness uniformity of thin film distribution is an important parameter in science and industry, which can be obtained by atomic deposition processes in various film - substrate systems, affecting their electrical, optical, and mechanical properties. Film thickness uniformity provides confidence that specifications are being met and that will be no fluctuations in thickness from one product to another. It is guaranteed so a reliable process of thin films deposition. This paper deals with studying and experimentation of thin aluminium film deposition on plane substrate by vacuum thermal evaporation using profiled masks, also called correction diaphragms, introduced between the rotating substrate and the evaporation source. The facilities of the AV-100 laboratory installation are used, and a comparison of the results is given for three states of the substrate: fixed plane substrate, parallel to the source; rotating substrate without mask; rotating substrate with profiled mask. Interesting results are inferred and proposed to be an optimization solution.