The Interfacial Thermal Resistance Properties Of GNPs/Epoxy Thermally Conductive Composites By Molecular Dynamics Simulation

With the increasing power density and integration degree of electrical equipment, the problem of excess heat production is serious. Existing data show that the thermal management capability of electrical equipment is a key factor affecting the performance of electrical equipment. Therefore, the development of high thermal conductivity composites is an effective solution to improve the thermal management ability of equipment and extend the working life of equipment. With the purpose of enhancing the heat conduction of epoxy resin, graphene sheets (GNPs) with high thermal conductivity were added. Based on the reverse nonequilibrium molecular dynamics simulation (RNEMD) method, the thermal conductivity simulation of epoxy resin equipped with GNPs was carried out. The simulation results showed that the heat conductivity of epoxy resin equipped with GNPs had been greatly improved.