The future of dicing is here

Abstract The submicron era is here, and the projections show that the need will only increase for wafers, glass, ceramics, and metal parts with micron and sub‐micron‐level features on them. Such parts could be readily assembled into multi‐layered chips or devices, but still require some dicing. The highly flexible FemtoGlass system with Workshop of Photonics' (WOP) patented cutting technology [1] offers highly efficient and precise dicing solutions with a small heat‐affected zone (HAZ) and low surface roughness.