Thermohydraulic and thermal fatigue characteristics of W/Cu flat-type microchannel mock-up for CFETR divertor

The divertor of the China Fusion Engineering Test Reactor (CFETR) requires a more efficient heat dissipation structure due to the high demand of heat flux dissipation of up to 20 MW/m(2). Microchannel cooling technology excels in thermal management because of large heat transfer area to volume ratio and capability to achieve uniform temperature distribution. However, the heat transfer and thermal fatigue characteristics of W/Cu flat type mock-up with microchannel cooling structures at a heat flux of 20 MW/m(2) remains elusive. In this work, we analyzed the thermohydraulic (numerically) and thermal fatigue (experimentally) characteristics of W/Cu flat-type microchannel mock-up. The numerical results show that the thermal loaded area (W) of the microchannel mock-up possesses excellent temperature uniformity and heat transfer performance (the W surface temperature is only similar to 685 degrees C even at a low volumetric flow rate V = 5 L/min). We also compared the heat dissipation efficiency with the hypervapotron cooling channels, and found that the maximum temperature of the W surface and channel wall of the microchannel mock-up are reduced by 18.9 % and 46.7 %, respectively. The thermal stress analysis indicates that the maximum equivalent stress is concentrated in the middle region of the W surface at 15 s, with a value of 357.8 MPa that is below the maximum allowable stress of W material (425 MPa at 650 degrees C). The as-manufactured W/Cu flat-type microchannel mock-up successfully withstood a thermal fatigue test consisting of 1000 cycles at 20 MW/m(2) steady state heat load at V = 30 L/min and T-in = 25 degrees C. The maximum temperature of W is only 616.2 degrees C during the test, and some microcracks are detected on the W surface after the test; these microcracks are perpendicular to the heat loading surface, which have negligible influence to the heat transfer of the entire mock-up. This study reveals that the W/Cu flat-type microchannel mock-up is promising in dissipating ultra-high heat flux (steady-state 20 MW/m(2)) on the divertor target, which might provide valuable insights for the engineering design of the CFETR divertor.