Effects of accelerated curing in thermoplastic particle interleaf epoxy laminates
COMPOSITES PART A-APPLIED SCIENCE AND MANUFACTURING(2024)
摘要
Faster heating rates of 10 degrees C/min and higher process temperatures of 210 degrees C were applied to the commercial M21 resin system. The total process time was reduced by two-thirds while achieving the same degree-of-cure in the epoxy. Thermal analysis and hot-stage microscopy showed that the thermoplastic interleaf particles melt at around 15 degrees C above the manufacturer's recommended 180 degrees C curing temperature. A short dwell at 180 degrees C was found to prevent the thermoplastic particle from mixing with the thermoset pre-polymer before ramping to the accelerated curing temperature of 210 degrees C. Such interaction was found to decrease the glass transition temperature by 13-45 %, but increase the mode I delamination resistance by 70-105 %, respectively. The results demonstrate that accelerated curing of interleaf systems can shorten cycle time and produce a range of physical and mechanical properties from a single base material, opening the design space to new and optimised composite structures.
更多查看译文
关键词
A. Particle-reinforcement,B. Cure behaviour,B. Thermal properties,E. Prepreg processing
AI 理解论文
溯源树
样例
![](https://originalfileserver.aminer.cn/sys/aminer/pubs/mrt_preview.jpeg)
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要