The multiple synthesis of layered V2CTx-MXene particles as electrically conductive adhesive fillers in printed electronics

2D V2CTx was modified with Ag+ and rGO and doped into Ag copper-plated powder as a conductive filler to improve the conductivity of the conductive adhesive. The incorporation of 2D V2CTx composites connected the dispersed Ag copper-plated powder to form an effective conductive pathway. And as the content of 2D V2CTx composites increases, the resistivity of the epoxy conductive adhesives (ECAs) first decreases and then changes in an increasing trend. This is mainly because the right amount of 2D V2CTx can be established in conjunction with Ag copper-plated powder to form a conductive network inside the epoxy resin, but the increase in 2D V2CTx composite will accumulate in the epoxy resin, which in turn will impede the transmission of current, the resistivity can reach a minimum of 6.84 x 10-6 omega & sdot;m.