Monolithic Integration of Top Si3N4 - Waveguided Germanium Quantum-Dots Microdisk Light Emitters and PIN Photodetectors for On-chip Ultrafine Sensing

2022 International Electron Devices Meeting (IEDM)(2022)

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Abstract
Using a coordinated combination of lithographic patterning and self-assembled growth, Ge spherical quantum-dots (QDs) were controllably generated within host $Si_{3}N_{4}$ layers as active medium for Si photonics. A significant fabrication advantage of our approach is the high-temperature thermal stability of Ge QDs that are formed by thermal oxidation of poly-SiGe at $900^{o}C$, offering process flexibility in the waveguide-material choices and device designs. Our Ge QDs enable monolithic integration of $\mu$ disk light-emitters and PIN photodetectors (PDs) with top $Si_{3}N_{4}$/SiO 2 /Ge waveguide-coupled structures using standard Si processing. Over 95% coupling efficiency from SiN WGs to Ge QD PDs is achievable. Ultralow dark current of $0.1 pA/\mu m$, high responsivity of 3,500 A/W at 850 nm and 10A/W at 1550 nm, 3dB frequency $\gt10$ GHz for Ge-QD PDs and low threshold power of $0.6 kW/cm^{2}$ for optically-pumped Ge QD/SiN $\mu$ - disks lasing evidence the high degree of crystallinity of our Ge QDs as an effective building block for 3D SiN PICs.
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3D SiN,3dB frequency >,ac-tive medium,coordinated combination,coupling efficiency,frequency 10.0 GHz,Ge spherical quantum-dots,Ge-QD PDs,Ge-QD PDsis,germanium quantum-dots microdisk light emitters,high-temperature thermal stability,lithographic pat-terning,monolithic integration,noise figure 3.0 dB,On-chip Ultrafine Sensing,PIN photodetectors,process flexibility,Si photonics,Si3N4-SiO2/int,size 1550.0 nm,size 850.0 nm,standard Si processing,temperature 900.0 degC,thermal oxidation,waveguide-material choices,μ-disk light-emitters
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