Vertically Stacked Passive Silicon Photonic Chiplet by µ-Transfer Printing

Rai Kou,Guangwei Cong,Noritsugu Yamamoto,Hitoshi Kawashima,Yuriko Maegami,Toshiya Murai,Tai Tsuchizawa,Akihiro Noriki,Takeru Amano,Koji Yamada

2023 Conference on Lasers and Electro-Optics (CLEO)（2023）

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摘要

We device double-layer stacked silicon photonic MMIs by µ-Transfer Printing. A 900×100-µm ² -size chiplet consisting of a 220/60-nm-thick silicon core/slab structure is transferred twice onto thermal- and TEOS-SiO 2 under-cladding layers.

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