Design of an on-chip Vanadium Dioxide driven Plasmonic Modulator Based on Hybrid Orthogonal Junctions on Silicon-on-Insulator
2023 Conference on Lasers and Electro-Optics (CLEO)(2023)
Abstract
We present a plasmonic modulator using a hybrid orthogonal coupling geometry with vanadium dioxide as the modulation material on a silicon-on-insulator platform. The presented device is compact with a nanoscale modulating area and takes advantage of the first order insulator to metal transition of vanadium dioxide to achieve a high modulation depth of 46.89dB/μm. The device has applications in integrated high speed communications systems which require a high modulation depth as well as small device sizes.
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Key words
high modulation depth,hybrid orthogonal coupling geometry,hybrid orthogonal junctions,integrated high speed communications systems,modulation material,nanoscale modulating area,on-chip vanadium dioxide driven plasmonic modulator,order insulator,presented device,silicon-on-insulator platform
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