Electromagnetic-Thermal Multiphysical Modeling of Substrate Integrated Waveguide

Substrate integrated waveguides (SIWs) have many advantages and have been widely used in microwave circuits. As the integration density and the interconnection complexity of microwave circuits increases, the thermal effects no longer be ignored This paper introduces a multiphysical numerical technique based on the finite element method (FEM) to solve the electromagnetic-thermal effect of SIWs. The FEM can effectively simulate the steady and transient response of electromagnetic and thermal fields and can flexibly adapt to material properties, making it efficient for the analysis of electromagnetic-thermal problems in microwave devices.