Sub-10nm Ultra-thin ZnO Channel FET with Record-High 561 µA/µm ION at VDS 1V, High µ-84 cm2/V-s and1T-1RRAM Memory Cell Demonstration Memory Implications for Energy-Efficient Deep-Learning Computing

2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits)(2022)

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摘要
For the first time, we investigated ultra-short-channel ZnO thin-film FETs with L ch = 8 nm with extremely scaled channel thickness t ZnO of 3nm, the device exhibits ultra-low sub-pA/µm off leakage (1.2 pA/µm), high electron mobility (µ eff = 84 cm2/V•s) with record peak transconductance (Gm,) of 254 μS/μm at V DS = 1 V wrt. reported oxide-based transistors, to date, leading to high on-state current (I ON ) of 561 μA/μm. We demonstrated the integration of a ZnO access transistor with Al 2 O 3 RRAM to enable a 1T-1R memory cell, suitable for BEOL-embedded memory. We evaluate the system-level benefits of a hardware accelerator for deep learning to employ FET-RRAM as working memory—up to 10X energy-efficiency benefits can be achieved over current baseline configurations.
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关键词
high electron mobility,record peak transconductance,reported oxide-based transistors,ZnO access transistor,Al2O3 RRAM,BEOL-embedded memory,deep learning,FET-RRAM,energy-efficiency benefits,ultra-short-channel ZnO thin-film FETs,extremely scaled channel thickness tZnO,1T-1RRAM Memory Cell Demonstration Memory Implications,energy-efficient deep-learning computing,hardware accelerator,size 10.0 nm,voltage 1.0 V,size 8.0 nm,size 3.0 nm,ZnO
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