18.2 A 128Gb/s 1.95pJ/b D-Band Receiver with Integrated PLL and ADC in 22nm FinFET

2023 IEEE International Solid-State Circuits Conference (ISSCC)(2023)

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摘要
Recent work has shown the ability of mm-wave (30 to 100GHz) and sub- THz (100 to 300GHz) receivers to support large bandwidths needed to meet growing data-rate demands in a variety of applications, from dielectric waveguide [1] to wireless [2], [3] links. Unfortunately, prior art either excludes the integration of critical receiver blocks (e.g. PLL, ADC) or contains complete but power-hungry LO generation [2]. A critical challenge in demonstrating sub-THz receivers with an integrated ADC is the limited availability of process nodes that provide efficient performance for both RF and mixed-signal/digital circuits simultaneously. This work presents a D-band (140GHz) receiver (RX) which integrates the RX front-end (RXFE) with PLL and ADC in a 22nm FinFET process co-optimized for RF and digital performance. The RX achieves a maximum data-rate of 128Gb/s with a total efficiency of 1.95pJ/b.
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bit rate 128 Gbit/s,critical receiver blocks,current 18.2 A,D-band receiver,data-rate demands,dielectric waveguide,digital performance,FinFET process,frequency 140.0 GHz,frequency 30 GHz to 300 GHz,integrated ADC,integrated PLL,maximum data-rate,mixed-signal-digital circuits,mm-wave reecivers,power-hungry LO generation,process nodes,RF,RF circuits,RX front-end,RXFE,size 22.0 nm,sub-THz receivers,wireless links
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