A Dual-Band Micromachined On-Wafer Probe with Integrated Diplexer for Ultra-Broadband Measurements to 220 GHz

2023 IEEE/MTT-S International Microwave Symposium - IMS 2023(2023)

Cited 0|Views9
No score
Abstract
This work presents a micromachined dual-band probe for ultra-broadband single-sweep measurements to 220 GHz. The probe features both WR-5.1 waveguide and 1.0 mm coaxial inputs that are combined in an integrated passive diplexer. The probe shows a maximum loss in the crossover region of 6-7 dB and a minimum output return loss of 10 dB.
More
Translated text
Key words
on-wafer probes,on-wafer measurement,diplexer,broadband,rectangular waveguide,network analysis,calibration,millimeter-wave
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined