Design and Test of MEMS Resonant Accelerometer with a Novel Die-Attach Structure

Micromachined resonant accelerometers suffer from temperature drift caused by intrinsic thermal stress. In this paper, a novel die-attach structure made of glass is proposed to reduce the thermal stress resulting from the packaging process. Key parameters of the stress-isolated structure are optimized by finite element analysis. Accelerometer prototypes with such glass die-attach structure are fabricated and tested. The results show that the temperature sensitivity is 44.6 mu g/degrees C and the bias instability is only 0.297 mu g. With the benefits of easy-fabrication and high-isolation of thermal stress, the temperature-insensitive die-attach structure can be applied in the packaging of MEMS devices fabricated with SOG technology.