Reliability and Thermal Analysis of ACEPACK SMIT Power Module
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management(2023)
摘要
Power modules development is becoming more and more important for switching applications, to improve electric and reliability performances. This paper presents an experimental-numerical method to characterize the reliability behavior of ACEPACK(Trade Mark) SMIT package, a top side-cooled module designed with a half bridge topology, which employs high-voltage silicon MOSFETs. The experimental test involves power cycling to study the reliability and thermal behavior. Then, a finite-element based model is developed to simulate test conditions, to calculate temperature behavior inside the package.
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