Thermal-Aware Fixed-Outline 3-D IC Floorplanning: an End-to-End Learning-Based Approach
IEEE TRANSACTIONS ON VERY LARGE SCALE INTEGRATION (VLSI) SYSTEMS（2023）
Key words
3-D integrated circuits (3-D ICs),deep k-means clustering,floorplanning,graph convolutional network (GCN),multiagent deep reinforcement learning (MADRL)
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