Analysis of Traps Behavior Related to Body-Biased Hot Carrier Degradation in 14 nm nFinFETs

IEEE Transactions on Electron Devices(2023)

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摘要
In this study, interface and oxide traps in relation to body-biased hot carrier degradation (HCD) in 14 nm nFinFETs are investigated. An accelerated degradation of device performance is observed as a function of body bias voltage. In particular, the interface traps show a rapid response even at low body bias levels, while the oxide traps show an increase only above a certain body bias threshold. The location of the newly generated traps is meticulously analyzed and the quantized oxide traps are characterized using pulsed I-V measurements. In addition, a comprehensive analysis of the corresponding carrier transportation mechanism is built based on the trap location.
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关键词
Channel-initiated secondary electron (CHISEL),FinFET,hot carrier reliability,interface traps,oxide traps,reverse body bias
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