Mobilint’s ARIES: Chip for Edge AI
2023 IEEE International Conference on Consumer Electronics-Asia (ICCE-Asia)(2023)
摘要
The advancement of AI technology has led to its widespread adoption in a variety of fields. However, in the edge environment, there is currently no AI chip that effectively meets the market’s demands for performance, power efficiency, and price. As a result, AI applications have not been fully realized in edge contexts. To address this gap, we present ARIES, an innovative AI chip developed by Mobilint, a fabless company headquartered in South Korea. ARIES embodies superior performance, high power efficiency, and competitive pricing. Mobilint offers ARIES in two distinct forms: the PCIe card MLA100 and the AI box MLX-A1, each designed to maximize utility. To further enhance user engagement, a user-friendly software development kit (SDK) named qb is also provided to simplify deployment.
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关键词
Deep learning accelerator,edge,AI
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