Comparison of Thermal Behaviour of Commercial Packages for Power Devices

Lorenzo Giraudi,Maurizio Tranchero,Claudio Romano,Paolo Santero

2023 29TH INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS, THERMINIC（2023）

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摘要

This paper investigates the thermal performances of four different packages from two different suppliers, both topside and bottom side cooled using 3D CFD simulation. The results show the pros and cons of both solutions.

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关键词

power electronics,package,simulation

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