Dy-MFNS-CAC: An Encoding Mechanism to Suppress the Crosstalk and Repair the Hard Faults in Rectangular TSV Arrays

Through-silicon vias (TSVs) play the role of vertical electrical interconnections in the emerging three-dimensional stacked integrated circuits. However, the hard faults and the crosstalk faults may occur in the TSV array simultaneously. The hard faults are the catastrophic faults that lead to functional failure, and the crosstalk faults deteriorate the signal integrity of TSV array. The previous fault tolerant techniques for this problem are based on the Fibonacci numeral system-based crosstalk avoidance code (FNS-CAC), and the bit overhead and the reparability need to be further improved. This article proposes the dynamic modified Fibonacci numeral system (Dy-MFNS) and the Dy-MFNS based crosstalk avoidance code (Dy-MFNS-CAC). The cascaded Dy-MFNS adders and the Dy-MFNS codec are designed to generate the Dy-MFNS-CAC codewords according to the health status of TSVs. The generated codewords are able to suppress the crosstalk and repair the hard faults simultaneously, under the control of the TSV fault flags. The simulation results show that the proposed scheme has advantages on both the bit overhead and the reparability compared with the FNS-CAC based techniques.