The Effect of Compound Growth on the Microstructure and Properties of Titanium-Steel Clad Plate Subjected to High Temperature Heat Treatment

To study the effect of interfacial reaction phase growth on the properties of titanium-steel clad plate, the rolled titanium-steel clad plate was heat treated at 1000 °C for 1-10 h. Then, the microstructure and reaction phase generation growth mechanism of the composite interface under different holding times were analyzed. And the mechanical properties of the bonding interface of the composite plate were tested by nanoindentation test, hardness test and tensile test. The results showed that when heated at 1000 °C for various holding durations, there was no new alteration in the interface microstructure. TiC, Fe 2 Ti, and FeTi compounds were generated at the interface bond as the holding duration rises due to the accelerated diffusion of elements at the interface. These compounds accumulated at the interfacial junction with a staggered distribution. According to the diffusion thermodynamics and experimental results, the mechanism of the formation and growth of the compound at the bonding interface was constructed. The reaction phase was not altered by the lengthened holding period, but it did encourage compound development and result in a thicker reaction layer. The tensile strength of the titanium-steel composite plate steadily declined as the thickness of the reaction layer rose, which caused interfacial delamination and a dramatic shift in the tensile curve of the composite plate.