3D silicon interposer for terabit/s transceivers based on high-speed TSVs

Bogdan Sirbu,Kai Zoschke,Stephane Bernabe,Quentin Wilmart,Tolga Tekin

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

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摘要

This paper shows the novel and successful post-processed integration of high-speed and high-bandwidth TSVs by Fraunhofer IZM on CEA-Leti Silicon Photonics wafers. The design of such structures and the fabrication process flow at both foundries are described in detail in this paper. Moreover, the characterization results of the developed TSVs test-structures are presented, showing an electrical bandwidth higher than 67 GHz.

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关键词

TSV,High-Speed Interconnects,Silicon Photonics,SiP,flip-chip,3D integration,MPW

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