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Demonstration of a CMOS-Compatible Superconducting Cryogenic Interposer for Advanced Quantum Processors

King-Jien Chui, Hongyu Li,Yong Chyn Ng,Chit Siong Lau,K. E. J. Goh,D. Huang,Ya-Ching Tseng, J. K. Chen, H. Yu, B. N. Jaafar, H. Lin, B. Varghese

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

引用 1|浏览18
关键词
Superconducting interconnects,TSV,interposer,cryogenic
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