Research on the Distribution of the Circulation of Double-sided Polishing Method Based on Processing Forecast Modeling

2023 IEEE International Conference on Manipulation, Manufacturing and Measurement on the Nanoscale (3M-NANO)(2023)

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摘要
For non-confirmed processing for the ring pendulum double-sided polishing (RPDP), this article constructs a machining prediction model based on the motion principle and pressure distribution principle of the RPDP equipment, and conducts simulation experiments using the machining prediction model as a platform It was found that the instantaneous material reduction is mainly distributed within the radius range of the pendulum grinding disc at the center of the component. The distribution of the large instantaneous material reduction band does not exceed the radius range of the pendulum grinding disc at the center of the component, and is independent of changes in the size and swing mode of the pendulum grinding disc. The large instantaneous material reduction band contracts inward as the swing interval of the pendulum grinding disc moves outward. Based on this law, this article guides practical processing by cupper the surface profile of optical components from $2.27 \lambda(\lambda=632.8 \mathrm{~nm})$ reduced to $1.85 \lambda$, and the obtained processing rules can effectively guide actual processing.
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