Hybrid Substrate With Ultralarge Organic Interposer for Heterogeneous Integration

In this study, the fan-out chip-last panel-level packaging method in fabricating an ultralarge organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a hybrid substrate ( 85x80 mm), which consists of an ultralarge organic interposer (four redistribution layers (RDLs) with the minimum metal linewidth ( L ) and spacing ( S ) = 2 mu m ), a 5-2-5 build-up package substrate, and Sn0.7Cu solder joints with underfill. Also, some recommendations will be provided.