Prediction and Analysis of Radiated EMI from a Wafer-Level Package Based on IC Source Modeling
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY(2024)
关键词
Electromagnetic interference,Integrated circuit modeling,Semiconductor device modeling,Current measurement,Voltage-controlled oscillators,Predictive models,Capacitors,Electromagnetic interference (EMI),integrated circuit (IC),radiated emission,redistribution layer (RDL),wafer-level package (WLP)
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