Thermal cycling characterization of integrated GaN power module
2023 25TH EUROPEAN CONFERENCE ON POWER ELECTRONICS AND APPLICATIONS, EPE'23 ECCE EUROPE（2023）
Abstract
A thermal cycling test is developed on a low parasitic inductance integrated GaN power module by monitoring the electrical and thermal parameters. The failure points of DBC and solder attach leading to increased thermal resistance are located, and the failure mechanism is analyzed based on Scanning Acoustic Microscope observation.
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Key words
Degradation,Failure modes,Gallium Nitride (GaN),Packaging,Thermal cycling
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