Thermal creep and fatigue failure of the sintered silver solder in a SiC-IGBT module under power cycling

•Sintering parameters on thermomechanical performance of the silver film were analyzed.•Anand constitutive model of sintered silver was constructed by the creep tests.•Electro-thermal–mechanical coupling analysis was conducted to obtain the cyclic creep behavior of the sintered silver solder.•Creep fatigue life prediction of the sintered silver solder from FEM analysis was verified by power on–off cycling tests.