Multi-scan cyclic voltammetry to roughen the surface of copper foil for application in copper-clad laminates

Multi-scan cyclic voltammetry is proposed to prepare copper foils with a matte side for use in copper-clad laminates (CCLs). During multi-scan cyclic voltammetry at -1 V & SIM; 0.5 V at 80 & DEG;C, the shiny side of electrolytic copper foil was subjected to zinc deposition, zinc-copper interdiffusion (alloying), and zinc dissolution (de-alloying) processes. After 21 CV cycles (315 s), small islands with a height range of 0.5 & SIM;2 & mu;m and irregular voids formed on the matte side of the copper foil. The prepared copper foil had a specific surface area of 2.39 m(2) g(-1) as measured by N-2 adsorption and desorption, which is greater than that of commercial copper foil with a matte side. When the copper foil was laminated as CCL, the prepared CCL had an average peel strength of 1.92 N mm(-1), indicating that this route could be used for high-performance CCLs.