Creep behaviors of nanocrystalline copper after stress reduction under nanoindentation at ambient temperature

MATERIALS LETTERS（2023）

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摘要

•Composite model is used to study the creep behaviors of the nanocrystalline Cu.•Positive and negative creep behaviors can be detected under nanoindentation.•Mechanisms are the results of competition between dislocation slip and GB activities.

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关键词

Nanocrystalline,Stress reduction tests,Nanoindentation,Positive/negative creep

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