Intermetallic Compounds as Alternatives to Copper for Advanced Interconnect Metallization

Christoph Adelmann,Jean-Philippe Soulie,Jeroen E. Scheerder,Claudia Fleischmann,Kiroubanand Sankaran,Geoffrey Pourtois,Johan Swerts,Zsolt Tokei

2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM（2023）

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摘要

Recently, the search for alternative metallization schemes beyond Cu has been extended from elemental metals to binary and ternary intermetallics. Here, we review our material selection process for binary intermetallic compounds and discuss the additional complexities to understand the transport in such metals with respect to elemental metals. A simple but practical resistance model for binary compounds is proposed by extending the Mayadas-Shatzkes model for ordered intermetallics.

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关键词

interconnect,metallization,binary aluminides,intermetallic compounds

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