Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM(2023)
Abstract
NbxTi((1-x))N is a promising alternative to replace conventional Nb in superconducting devices. In this work, short loop devices with metal lines and vias were fabricated in IMEC 300-mm pilot line using direct metal etch, semi-damascene approach. Single line resistance of NbxTi((1-x))N wires show that > 95% of devices meet the expected resistance of < 5000 Omega/mu m and leakage measurements show that > 95% of devices have low leakage of < 1E-16 A/ mu m. Low temperature measurements show that the NbxTi((1-x))N wires have transition temperature of 12.5K within 0.5K that of thin film and a critical current of 0.15 mA, within 2X of theoretical maximum.
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Key words
Interconnect,BEOL,Semi-damascene,Line Resistance,Leakage Current,NbxTi((1-x))N,Superconductors,T-c
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