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Integrating 8nm Self-Aligned Tip-to-Tip to Enable 4-Track Standard Cell Architecture As Scaling Booster

P. Marien, V. V. Gonzalez,S. Choudhury,D. Radisic,S. Decoster,S. Kundu,Y. Hermans, B. Kenens,H. De Coster, E. A. Sanchez,A. Peter,A. S. Marquez,N. Jourdan,D. Batuk,J. Ryckaert,G. Murdoch,S. Park,Z. Tokei

2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM（2023）

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Key words
MOL scaling booster,VHV,self-aligned tip-to-tip,Ru direct metal etch
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