A Direct Bond Interconnect 3D Co-Integrated Silicon-Photonic Transceiver in 12nm FinFET with-20.3dBm OMA Sensitivity and 691fJ/bit

Anirban Samanta,Po-Hsuan Chang,Peng Yan,Mingye Fu,Mehmet Berkay-On,Ankur Kumar,Hyungryul Kang,Il-Min Yi,Dedeepya Annabattuni,Yu Zhang,David Scott,Robert Patti,Yang-Hang Fan,Yuanming Zhu,Samuel Palermo,S. J. Ben Yoo

2023 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXHIBITION, OFC（2023）

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Abstract

We present the first experimental demonstration of an electronic-photonic co-designed transceiver circuit heterogeneously 3D co-integrated with high-density, low parasitic Direct Bond Interconnect (DBI (R)) featuring full SerDes that achieves -20.3dBm OMA sensitivity and 691fJ/bit link energy efficiency. (c) 2022 The Author(s)

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