PIC-Based Transceiver for Access Networks: Package and Functionalities Verification towards a Commercial Solution.

ICTON(2023)

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摘要
InP monolithic PIC design packaged towards a standard form factor transceiver level is presented, showcasing the packaging options taken and presenting the overall transceiver performance against key specifications for access networks demonstrating the commercial feasibility of PIC based transceivers for these applications.
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关键词
Photonic Integrated Circuits (PICs),Passive Optical Networks (PONs),packaging,co-packaging
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