Keynote Speech 3: Exploring the Synergy of 3D Integration and Hardware Security.

As the demand for increased transistor density and performance in integrated circuits (ICs) continues to surge, three-dimensional (3D) integration has emerged as a promising technology. By moving beyond traditional two-dimensional (2D) chips, 3D integration unveils new avenues for computing platforms, including high-performance processors and enhanced computation density. This innovative technology offers advantages such as reduced package size, lower power consumption, improved bandwidth, and enhanced computation density. However, like a double-edged sword, 3D integration also brings unique and unexplored challenges in managing the security of 3D ICs. This keynote address delves into the novel opportunities presented by 3D integration for security mechanisms. It explores how this technology can be leveraged to strengthen hardware security, enabling robust protection against evolving threats. Additionally, it sheds light on the potential security vulnerabilities that may arise in 3D ICs, emphasizing the need for careful consideration and proactive measures to address them.