Dual-anchor anti-corrosion coating of copper foil for high-speed interconnects

We developed a new copper foil sample treated with (2-(Methylthio)pyrimidin-4-yl)methanamine (MET) for 2h, which can remarkably improve anti-corrosion performance and peel strength. First-principles calculations confirmed that the S-Cu and N-Cu bonds were both formed on the Cu (1 1 1) surface for MET, which contributes to the improved stability of the coating. In contrast, only the S-Cu bond was found for 2-(Methylsulfanyl)pyrimidin-4-amine (AMI).