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GH3230合金热控凝固试板补缩距离与缩松判据研究

LIAO Jia-li, SUN Xun,GUAN Yang,LIU Xiao-fu,SHUI Guo-yan,MA Lan-bo,GUO Xin-li, JIN Lei

Foundry（2023）

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Abstract
针对GH3230合金热控凝固试板补缩距离与缩松判据开展研究,获得了真空水冷热控凝固工艺下不同厚度试板的补缩距离,是真空重力铸造各厚度试板补缩距离的10～14倍以上.通过数值模拟计算得到GH3230合金凝固成形产生缩松的临界判据值为10.0 K0.5·s0.5·cm-1,并完成反推验证,准确度达到96%.为提高试样凝固时的温度梯度,进行了锡冷热控凝固试验,发现锡冷热控凝固工艺可以消除300 mm×3 mm试板的缩松缺陷.
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