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Deep neural network aided Monte Carlo simulation in solder joint failure probability analysis

Chunsheng Cui,Seyedmasoud Hashemi

Materials Letters（2023）

Cited 0|Views3
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Abstract
•Providing an intelligent sampling method in Monte Carlo simulation for reliability assessment.•Considering the critical points in the uncertainties.•Physics of failure based lifetime evaluation for the solder joint in power semiconductors.
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Key words
Artificial Intelligence, Electronic materials, Semiconductors
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