Thermoelectric hotspot cooling using thermally conductive fillers

Sang J. Park,Junyoung Park,Ki Mun Bang, Jung Min Lee,Woosung Park,Pawel Ziolkowski,Hyungyu Jin

Applied Thermal Engineering（2023）

引用 0|浏览4

暂无评分

摘要

•Highlights new perspective on thermoelectric cooler (TEC) design for hotspot cooling.•Proposes the thermally-conductive filler-embedded TEC (F-TEC) as an example.•Demonstrates F-TEC has 42.5% higher heat-dissipation capability than conventional TEC.•Visualizes temperature gradient applied to thermoelectric legs using an IR camera.•Presents additional considerations for improving the F-TEC.

查看译文

关键词

thermoelectric hotspot cooling

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要