Chip on a Fiber Toward the E-Textile Computing Platform

Abstract Electronic textiles have been considered one of the desired device platforms due to their dimensional compatibility with fabrics by weaving them with yarn. However, the existing electronic textile platforms are generally composed of only one type of electronic component with a single function on a fiber substrate because of processing challenges. A precise connecting process between each electronic fiber is essential to configure the desired electronic circuits or systems. Here we present a chip on a fiber, a new electronic fiber platform, by introducing large scale integration of electronic device or circuit components onto a one-dimensional microfiber substrate. The electronic components such as transistors, inverters, ring oscillators, and thermocouples were integrated together onto the outer surface of a fiber substrate with precise semiconductor and electrode patterns. Our results show that the electronic components can be integrated on a single fiber with reliable operation. We evaluate the electronic properties of the chip on a fiber as a multifunctional electronic textile platform by testing their switching and data processing, as well as sensing or transducing units for detecting optical/thermal signals. The demonstration of the chip on a fiber suggests significant proof of concepts for realization of high performance with wearable electronic textile systems.