Rapid and effective method of laser metallization of dielectric materials using deep eutectic solvents with copper acetate

In this paper, we proposed rapid laser-induced synthesis of copper micropatterns on the surface of oxide glass from deep eutectic solvents (DESs) consisting of choline chloride, citric or tartaric acid, and copper acetate as the copper plating solutions. It was shown that upon the 532-nm continuos wave laser irradiation, it is possible to increase the deposition rate of copper and create micropatterns with a resistance close to the value of pure metal together with high adhesion to the substrate surface. This metallization method is favorable for the practical use of copper patterns, including in the production of new printable microelectronic devices. Thus, we demonstrated the possibility of copper deposition on arbitrary three-dimensional surfaces. Moreover, the resulting copper micropatterns were tested as working electrodes for non-enzymatic glucose. Finally, the proposed technology can be successfully used for the design and development of sensor platforms for the electrochemical analysis and microelectronic devices. Graphical abstract