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Potential mechanisms of interstitial atomic enhancement and interface failure behavior in Ni3Co/Cu systems

Yizhe Du, Yinhui Chen,Xinyi Yuan,Peng Liu,Mujun Long,Dengfu Chen

Applied Surface Science（2023）

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Abstract
•Interstitial atoms tend to segregate towards the Ni3Co/Cu interface.•Interstitial atoms strengthen interfacial local bonding.•It can be divided into three phases from the onset of strain to the failure of the Ni3Co/Cu interface.•Potential mechanism of coating/substrate interface strengthening by interstitial atoms identified.
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Key words
Interstitial atoms doping,Interface structure,Interface mechanical properties,First-principle tensile tests,Electronic structure
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