Review of Hybrid Integration Techniques for Integrating III-V Onto Silicon
2023 IEEE International 3D Systems Integration Conference (3DIC)（2023）
关键词
photonics,advanced packaging,heterogeneous integration,3DHI,PIC,hybrid integration,silicon photonics
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要