Holistic Understanding of Best Engineering Practice to Extend Cooling Limit of Next Generations of GPU
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)（2022）
关键词
Power Density,High Temperature,Si. CPU,GPU,FPGA,Thermal,Cooling technologies,Liquid Cooling,Immersion Cooling,Microfluidic Cooling,Two-Phase Liquid Cooling
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