Automated Analysis of AFM Data of High-Density Cu Pad for Fine Pitch Wafer-to-Wafer (W2W) and Chip-to-Wafer (C2W) Hybrid Bonding
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC)（2022）
关键词
3D packaging,AFM data,AFM data analysis,atomic force microscopy,automated analysis,bonding surface,C2W,chip-to-wafer hybrid bonding,copper bond pad dishing,copper bond pad potrusion,critical surface parameters,Cu/el,data crunching,dielectric erosion,dies stacking,efficient order analysis methodology,first-order analysis methodology,heterogeneous integration,high-density copper pad,manual measurement,pitch wafer-to-wafer,pitch wafer-to-wafer hybrid bonding,Python code,quick order analysis methodology,surface morphology,surface roughness,W2W
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