A Special Electrode Can Be Bonded to Stainless Steel for High Temperature Application in MEMS Structure

Abstract In the fabrication process of micro piezoelectric energy harvester (MPEH), the high annealing temperature, 520 degrees Celsius is crucial to ensure the quality of the piezoelectric thick film deposited with Aerosol deposition method. In this paper, different electrode stack composition with different thicknesses are investigated. The goal is to find an electrode stack that can sustain the high annealing temperature, be well bonded to the stainless steel, resist high pull-off forces with soldered bonding wire, and have the least expensive platinum (Pt) usage. A set of experiments are designed to investigated different composition of electrode stack, and the soldered binding wire pull-off force was tested to find out the optimized stack configuration.