Quantitative Evaluation Method of Plating Adhesion in Plated Fiber

We propose a novel method “embedded and pull-out test” to quantitively evaluate adhesion in plated fiber. In the method, the plating fiber is embedded only some length at one end into resin, and the other end of fiber is pulled to conduct pull-out test. For the samples whose plating exfoliated without fiber breaking, we measure the maximum load in the pullout test and the length of plating exfoliation. The plating adhesion can be evaluated quantitatively as interface stress from the maximum load and the exfoliated length. Using the proposed method, we examined plating adhesion of copper plating high-strength polyarylate fibers which were plated at the two different processing company. As a result, it is confirmed that the maximum load and exfoliated length have a mostly proportional relation, and the plating adhesion is able to be evaluated quantitatively as interface stress. The plating adhesion of two samples which did not show any difference in the peel test can be confirmed that there was about two times difference in this method.